1 Bottles BGA Reballing Balls ( 0.5 ) BGA Solder Ball leaded For BGA Rework Repair Too

60.00

Out of stock

SKU: 8104 Category:

Description

Description: Brand new and high quality. Solder (Tin) paste is the best choice of reballing IC. It is used instead of the pin in the IC component package structure. Specificaton: Size: 0.2mm~0.65 mm Quantity: 25,000PCS per Bottle Condition: Brand New Balls Alloy: Sn63/Pb37 Standard: RoHs Available & SGS Tested

Additional information

Weight 0.1 g
Dimensions 20 × 10 × 0.5 cm

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